AMP TE Connectivity AMP MCP Interconnection System

TE Connectivity AMP Multiple Contact Point (MCP) Interconnection System provides a modular electrical interconnection solution for power and signal applications in automotive and industrial environments. These connectors support wire-to-wire, wire-to-board, and wire-to-device configurations while accommodating a range of wire sizes and ensuring secure mating through mechanical polarization. The AMP MCP system incorporates sealed and unsealed versions and offers integrated secondary locking and color keying to prevent improper assembly. These components come in contact sizes of 1.5mm, 2.8mm, 6.3mm, and 9.5mm, a plating temperature range from -40°C to +150°C, and a durability of 10 to 100 cycles. The AMP MCP connector system is used in powertrain, control, and signal applications where stable and durable interconnections are required.

Features

  • Color keying options
  • CuNiSi base material
  • High current carrying capacity
  • High reliability
  • High vibrational load
  • Integrated secondary locking
  • Large range of wire sizes
  • Low terminal mating force
  • Mechanical polarization
  • Modular design
  • Multiple connection types
  • Multiple contact points
  • Multiple contact size options
  • Secondary locking possibilities from four sides
  • Wide contact plating temperature range

Applications

  • Automotive: 
    • Chassis systems
    • Convenience
    • Door to body
    • Driver Information
    • Entertainment
    • Powertrain systems
    • Safety systems

Technical Specifications

Parameters Values
Contact Sizes 1.5mm, 2.8mm, 6.3mm and 9.5mm
Mating Force 6N
Current Carrying Capacity 48V
Wire Sizes 0.2mm² to 16mm²
Number of Positions 1 to 100
Contact Plating Temperature Ranges  -40°C to +150°C