Amphenol Industrial RADSOK Power to Board Connectors

Amphenol Industrial RADSOK Power to Board Connectors include the RADSERT, PowerBlok, PGY, and RadStack series that deliver high-power interconnect solutions within compact footprints. The RADSOK power-to-board connectors support a range of configurations, including orthogonal, co-planar, and mezzanine connections. These RADSOK connectors feature a hyperbolic socket design, ensuring multiple points of contact, and reducing failure modes, such as burnouts and stress fractures.

The RADSERT and PowerBlok series are suited for backplane power interfaces, offering compliant pins and solder options that enhance durability and reliability. The PGY series provides flexible PCB-to-PCB and PCB-to-bus bar connections, while the RadStack series supports low-profile mezzanine connections between parallel PCBs. All RADSOK connectors are RoHS compliant and operate within a temperature from -40°C to +125°C. Typical applications include backplane power interfaces, high-power electrical systems, mezzanine connections, and PCB Interconnects.

Features

• Compatible with surface mount technology for flexible integration
• Complies with RoHS standards
• Eliminates the need for threaded fasteners and special crimp tools
• Features a compact footprint for efficient use of space
• Offers optional touchproof covers for added safety
• Provides durability and reliability in demanding applications
• Utilizes a hyperbolic socket design that ensures multiple contact points for enhanced reliability

Applications

• Backplane power interfaces
• High-power electrical systems
• Mezzanine connections
• PCB interconnects

Technical Specifications