Amphenol FCI Hyper Cool Edge Connectors
Amphenol Hyper Cool Edge Connectors support high-speed data transmission with integrated cooling. These connectors combine signal, power, and thermal interfaces in a single solution. The design enables high-density board-to-board connections for demanding computing environments. The Hyper Cool Edge connectors support up to 112GT/s PAM4 per differential pair at 32GT/s with a 1.27mm pitch, 4-row configuration, 4C/4R or 6C/6R power modules, and 1U or 2U cold plate cooling options. These components are used in data centers, high-performance computing, networking infrastructure, and storage systems.
Features
- 4-row signal configuration
- Board-to-board and cable-to-board compatibility
- Cold plate integrated thermal interface
- Direct card-edge interface
- High-density signal and power integration
- Meets SFF-TA-1037 specifications
- Press-fit termination option
- Scalability for future bandwidth requirements
- Signal, power, and thermal paths
- Suitable for vertical and right-angle configurations
Applications
- Accelerators
- Artificial Intelligence (AI)
- Machine learning
- Server and storage
- XPU/CXL/NIC module
Technical Specifications
| Parameters | Values |
|---|---|
| Contact Pitch | 0.6mm |
| Maximum Data Rate | 112GT/s PAM4 |
| Power Module Configuration | 4C/4R or 6C/6R columns/rows |
| Operating Temperature Range | -40°C to +105°C |
| Number of Signal Rows | 4 |
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